Is product screen enough to guarantee low failure rate for the customer?
- M.W. Ruprecht
- G. La Rosa
- et al.
- 2001
- IRPS 2001
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32 results for Ronald Filippi
New aqueous clean for aluminum interconnects: Part I. Fundamentals
- D.L. Rath
- R. Ravikumar
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
New aqueous clean for aluminum interconnects: Part II. Applications
- R. Ravikumar
- D.L. Rath
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines
- K.P. Rodbell
- L. Gignac
- et al.
- 2000
- Journal of Applied Physics
Aluminum dual damascene metallization for 0.175 μm DRAM generations and beyond
- R.F. Schnabel
- L. Clevenger
- et al.
- 2000
- Microelectronic Engineering
Influence of sidewall roughness on the reliability of 0.20-μm Al RIE wiring
- R. Ravikumar
- H. Cichy
- et al.
- 1999
- IITC 1999
Challenges of Aluminum RIE Technology at sub 0.45 μm Pitches
- R. Ravikumar
- R. Filippi
- et al.
- 1999
- IITC 1999
Electromigration behavior of hot-sputtered Al(Cu) versus chemical vapor deposition W vias
- R. Filippi
- E.N. Levine
- et al.
- 1997
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Effect of copper on the microstructure and electromigration lifetime of Ti-AlCu-Ti fine lines in the presence of tungsten diffusion barriers
- A. Domenicucci
- R. Filippi
- et al.
- 1996
- Journal of Applied Physics
A Highly Reliable Low Temperature Al-Cu Line/Via Metallization for Sub-Half Micrometer CMOS
- R.V. Joshi
- H. Dalai
- et al.
- 1995
- IEEE Electron Device Letters