Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

22 results for Leo Tai

Hybrid clean approach for post-copper CMP defect reduction
- - Wei-Tsu Tseng
  - Vamsi Devarapalli
  - et al.
- 2013
- ASMC 2013
Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes
- - Wei-Tsu Tseng
  - Donald Canaperi
  - et al.
- 2012
- ASMC 2012
Comparative study of CVD TiN vs. ALD TiN for contact metallization in 32nm node and beyond
- - Valli Arunachalam
  - Filippos Papadatos
  - et al.
- 2010
- ADMETA 2010
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010
PECVD Low-k (∼2.7) dielectric SiCOH film development and integration for 65 nm CMOS devices
- - K. Ida
  - S. Nguyen
  - et al.
- 2005
- AMC 2005
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- Optics East 2005
Lower-k SiCOH integration for 65 nm ground rules
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- VMIC 2005
Ash-induced modification of porous and dense SiCOH inter-level-dielectric (ILD) materials during damascene plasma processing
- - T. Dalton
  - N. Fuller
  - et al.
- 2004
- IITC 2004
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- - Son Van Nguyen
  - Shobha Hosadugra
  - et al.
- 2017
- ECS J. Solid State Sci. Technol.
Post copper CMP hybrid clean process for advanced BEOL technology
- - Wei-Tsu Tseng
  - Vamsi Devarapalli
  - et al.
- 2013
- IEEE Trans Semicond Manuf