Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Publications
Date
Featured collections
Popular topics
43 results for Robert Polastre
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
- S.L. Wright
- R.J. Polastre
- et al.
- 2006
- ECTC 2006
Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
A CMOS-compatible process for fabricating electrical through-vias in silicon
- P. Andry
- C. Tsang
- et al.
- 2006
- ECTC 2006
High conductivity gate metallurgy for TFT/LCD's
- P.M. Fryer
- E.G. Colgan
- et al.
- 1998
- MRS Spring Meeting 1998
High conductivity gate metallurgy for TFT/LCD's
- P.M. Fryer
- E.G. Colgan
- et al.
- 1998
- MRS Spring Meeting 1998
Electrical test sites for AMLCD-TFT array process characterization
- E.G. Colgan
- R.J. Polastre
- et al.
- 1998
- MRS Spring Meeting 1998