Residual stresses in polymeric passivation and encapsulation materials
- I.C. Noyan
- L.T. Nguyen
- 2004
- Polymer Engineering & Science
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66 results for I.C. Noyan
X‐ray determination of encapsulation stresses on silicon wafers
- L.T. Nguyen
- I.C. Noyan
- 2004
- Polymer Engineering & Science
Finite size effects in stress analysis of interconnect structures
- I.C. Noyan
- Conal E. Murray
- et al.
- 2004
- Applied Physics Letters
Microscale laser shock peening of thin films, part 2: High spatial resolution material characterization
- Wenwu Zhang
- Y.Lawrence Yao
- et al.
- 2004
- Journal of Manufacturing Science and Engineering
Microscale laser shock peening of thin films, Part 1: Experiment, modeling and simulation
- Wenwu Zhang
- Y.Lawrence Yao
- et al.
- 2004
- Journal of Manufacturing Science and Engineering
Strain effects in thin film/Si substrates revealed by X-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2004
- Powder Diffraction
Imaging material components of an integrated circuit interconnect
- Zachary H. Levine
- Steven Grantham
- et al.
- 2003
- Journal of Applied Physics
Mapping of strain fields about thin film structures using x-ray microdiffraction
- C.E. Murray
- I.C. Noyan
- et al.
- 2003
- Applied Physics Letters
Nanometer precision metrology of submicron Cu/SiO2 interconnects using fluorescence and transmission x-ray microscopy
- Guangyong Xu
- D.E. Eastman
- et al.
- 2003
- Journal of Applied Physics
The physical design of on-chip interconnections
- Mary Y.L. Wisniewski
- Emmanuel Yashchin
- et al.
- 2003
- IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems