X. Su, C.B. Stagarescu, et al.
Applied Physics Letters
The x-ray fluorescence and soft x-ray transmission microscopy was used to quantitatively measure in situ Cu/SiO2 interconnect dimensions down to 0.3 μm. The methods and analysis techniques for measuring submicron linewidths, thicknesses and lengths with accuracies of 30-60 mm precisions, were also discussed. A simplifying 1D approximation was made that all Cu structures were very long in the longitudinal direction.
X. Su, C.B. Stagarescu, et al.
Applied Physics Letters
D.E. Eastman, C.B. Stagarescu, et al.
Physical Review Letters
C.E. Murray, I.C. Noyan, et al.
MRS Proceedings 2003
Guangyong Xu, X. Su, et al.
Applied Physics Letters