Publications

230 results for King-Ning Tu

Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
- - Jae-Woong Nah
  - J.O. Suh
  - et al.
- 2006
- Journal of Applied Physics
Transmission electron microscopy of the formation of nickel silicides
- - H. Föll
  - P.S. Ho
  - et al.
- 2006
- Philosophical Magazine A: Physics of Condensed Matter, Structure, Defects and Mechanical Properties
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
- - Albert T. Wu
  - N. Tamura
  - et al.
- 2005
- MRS Spring Meeting 2005
Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
- - Albert T. Wu
  - J.R. Lloyd
  - et al.
- 2005
- APM 2005
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
- - Albert T. Wu
  - K.N. Tu
  - et al.
- 2004
- Applied Physics Letters
Preparation and structure of Fe-doped EuO films
- - K.Y. Ahn
  - K.N. Tu
  - et al.
- 2003
- Journal of Applied Physics
Mass transport along grain boundaries of silver
- - K.N. Tu
- 2003
- Journal of Applied Physics
X-ray topographic determination of the absence of lateral strains in ion-implanted silicon
- - K.N. Tu
  - P. Chaudhari
  - et al.
- 2003
- Journal of Applied Physics
X-ray study of interdiffusion in bimetallic CuSingle Bond signAu films
- - K.N. Tu
  - B.S. Berry
- 2003
- Journal of Applied Physics
Analysis of formation of hafnium silicide on silicon
- - C.J. Kircher
  - J.W. Mayer
  - et al.
- 2003
- Applied Physics Letters