Advanced plasma etch for the 10nm node and beyond
- 2013
- SPIE Advanced Lithography 2013
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95 results for Robert L. Bruce
Highly selective silicon nitride etching to Si and SiO2 for a gate sidewall spacer using a CF3I/O2/H2 neutral beam
- Daiki Nakayama
- Akira Wada
- et al.
- 2013
- Journal of Physics D: Applied Physics
Patterning of CMOS device structures for 40-80nm pitches and beyond
- Sebastian U. Engelmann
- R.M. Martin
- et al.
- 2012
- SPIE Advanced Lithography 2012
Post Porosity Plasma Protection applied to a wide range of ultra low-k materials
- Theo Frot
- Willi Volksen
- et al.
- 2012
- IITC 2012
Pattern collapse mitigation strategies for EUV Lithography
- Dario L. Goldfarb
- Robert L. Bruce
- et al.
- 2012
- SPIE Advanced Lithography 2012
Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
Characterization and mechanism of He plasma pretreatment of nanoscale polymer masks for improved pattern transfer fidelity
- Florian Weilnboeck
- D. Metzler
- et al.
- 2011
- Applied Physics Letters
A 0.021 μm2 trigate SRAM cell with aggressively scaled gate and contact pitch
- Michael A. Guillorn
- Josephine Chang
- et al.
- 2011
- VLSI Technology 2011
Post Porosity Plasma Protection a new approach to integrate k 2.2 porous ULK materials
- Theo Frot
- Willi Volksen
- et al.
- 2011
- IITC/MAM 2011
On the absence of post-plasma etch surface and line edge roughness in vinylpyridine resists
- R. Bruce
- Florian Weilnboeck
- et al.
- 2011
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics