Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma
- Dominik Metzler
- Robert L. Bruce
- et al.
- 2013
- JVSTA
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89 results for Robert L. Bruce
Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric
- Robert Bruce
- Sebastian Engelmann
- et al.
- 2013
- Journal of Physics D: Applied Physics
Highly selective silicon nitride etching to Si and SiO2 for a gate sidewall spacer using a CF3I/O2/H2 neutral beam
- Daiki Nakayama
- Akira Wada
- et al.
- 2013
- Journal of Physics D: Applied Physics
Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
Characterization and mechanism of He plasma pretreatment of nanoscale polymer masks for improved pattern transfer fidelity
- Florian Weilnboeck
- D. Metzler
- et al.
- 2011
- Applied Physics Letters
On the absence of post-plasma etch surface and line edge roughness in vinylpyridine resists
- R. Bruce
- Florian Weilnboeck
- et al.
- 2011
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Molecular structure effects on dry etching behavior of Si-containing resists in oxygen plasma
- R. Bruce
- T. Lin
- et al.
- 2010
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Dependence of polymer surface roughening rate on deposited energy density during plasma processing
- Sebastian Engelmann
- Robert L. Bruce
- et al.
- 2009
- Plasma Processes and Polymers
Dependence of photoresist surface modifications during plasma-based pattern transfer on choice of feedgas composition: Comparison of C4 F 8 - And CF4 -based discharges
- S. Engelmann
- R. Bruce
- et al.
- 2009
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics