Identifying and Removing Artifacts Formed During FIB TEM Sample Preparation of Semiconductor Devices
- Lynne Gignac
- John Bruley
- et al.
- 2025
- AReMS 2025
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95 results for Robert L. Bruce
Low RESET Current Mushroom-Cell Phase-Change Memory Using Fiber-Textured Homostructure GeSbTe on Highly Oriented Seed Layer
- Guy M. Cohen
- Amlan Majumdar
- et al.
- 2024
- physica status solidi RRL
A Novel Chalcogenide Based CuGeSe Selector Only Memory (SOM) for 3D Xpoint and 3D Vertical Memory Applications
- Wei-Chih Chien
- Jeffrey Zheng
- et al.
- 2024
- VLSI Technology and Circuits 2024
Future of plasma etching for microelectronics: Challenges and opportunities
- Gottlieb S. Oehrlein
- Stephan M. Brandstadter
- et al.
- 2024
- Journal of Vacuum Science and Technology B
A Novel Program-verify Free and Low Drift Multi-level Operation on Cross-point OTS-PCM for In-Memory Computing Application
- W.C. Chien
- C.L. Sung
- et al.
- 2024
- IMW 2024
Plasma Processing and the Semiconductor Supply Chain in an Era of Low GWP and/or PFAS-Free Gas Chemistries
- Eric A. Joseph
- Brooke Tvermoes
- et al.
- 2024
- CMC Conference 2024
Etching of iridium thin films in chlorine- and fluorine-based inductively coupled plasmas
- Juliano Borges
- Hongwen Yan
- et al.
- 2024
- SPIE Advanced Lithography 2024
A Comprehensive Study on the Pillar Size of OTS-PCM Memory with an Optimized Process and Scaling Trends Down to Sub-10 nm for SCM Applications
- W. Chien
- E. Lai
- et al.
- 2023
- IMW 2023
Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
New Phase-Change Materials by Atomic-Level Engineering the Dopants for Extremely Low Vth Drift at 85oC and High Endurance 3D Crosspoint Memory
- Michelle Cheng
- Alexander Grun
- et al.
- 2022
- IEDM 2022