Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- ECTC 2004
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67 results for Sung K. Kang
Evaluation of thermal fatigue life and failure mechanisms of Sn-Ag-Cu solder joints with reduced Ag contents
- Sung K. Kang
- Paul Lauro
- et al.
- 2004
- ECTC 2004
Study of IMC morphologies and phase characteristics affected by the reactions of Ni and Cu metallurgies with Pb-free solder joints
- Won Kyoung Choi
- Sung K. Kang
- et al.
- 2003
- ECTC 2003
Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
- Sung K. Kang
- Won Kyoung Choi
- et al.
- 2003
- ECTC 2003
Interfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Development of low cost, low temperature conductive adhesives
- S.K. Kang
- S. Purushothaman
- 1998
- ECTC 1998
Interfacial reactions with lead (Pb)-free solders
- R.S. Rai
- S.K. Kang
- et al.
- 1995
- ECTC 1995
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Spalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2004
- AGEC 2004