Effect of Zn doping on SnAg solder microstructure and electromigration stability
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- Journal of Applied Physics
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67 results for Sung K. Kang
The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2009
- Journal of Electronic Materials
The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2009
- Microelectronics Reliability
An overview of Pb-free, flip-chip wafer-bumping technologies
- Sung K. Kang
- Peter Gruber
- et al.
- 2008
- JOM
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008
Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2008
- ECTC 2008
An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate
- Sun-Kyoung Seo
- Sung K. Kang
- et al.
- 2008
- Journal of Electronic Materials
Undercooling and microhardness of Pb-free solders on various under bump metallurgies
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2008
- Journal of Materials Research
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev