Undercooling and microhardness of Pb-free solders on various under bump metallurgies
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2008
- Journal of Materials Research
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67 results for Sung K. Kang
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
- Moon Gi Cho
- Sung K. Kang
- et al.
- 2007
- Journal of Electronic Materials
Study of the undercooling of Pb-free, flip-chip solder bumps and in situ observation of solidification process
- Sung K. Kang
- M.G. Cho
- et al.
- 2007
- Journal of Materials Research
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
- Sung K. Kang
- Donovan Leonard
- et al.
- 2006
- Journal of Electronic Materials
The oxidation of lead-free Sn alloys by electrochemical reduction analysis
- Sungil Cho
- Jin Yu
- et al.
- 2005
- JOM
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
- Sung K. Kang
- Paul A. Lauro
- et al.
- 2005
- IBM J. Res. Dev
Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization
- Y.C. Sohn
- Jin Yu
- et al.
- 2004
- Journal of Materials Research
The microstructure of Sn in near-eutectic Sn-Ag-Cu alloy solder joints and its role in thermomechanical fatigue
- Donald W. Henderson
- James J. Woods
- et al.
- 2004
- Journal of Materials Research
Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
- Sung K. Kang
- Da-Yuan Shih
- et al.
- 2004
- JOM