Backscattered electron imaging in the scanning electron microscope: The use of either: (A) high incident energy or (b) an array detector
- L. Gignac
- O.C. Wells
- et al.
- 2008
- Microscopy and Microanalysis
Publications
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144 results for Lynne Gignac
Electromigration reliability of advanced interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- International Workshop on Stress-Induced Phenomena in Metallization 2007
Extendibility of NiPt silicide contacts for CMOS technology demonstrated to the 22-nm node
- Kazuya Ohuchi
- Christian Lavoie
- et al.
- 2007
- IEDM 2007
Comparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- JES
Impact of Cu microstructure on electromigration reliability
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- IITC 2007
Low dielectric constant nanocomposite thin films based on silica nanoparticle and organic thermosets
- Qinghuang Lin
- Stephen A. Cohen
- et al.
- 2007
- Journal of Polymer Science, Part B: Polymer Physics
Use of backscattered electron detector arrays for forming backscattered electron images in the scanning electron microscope
- Oliver C. Wells
- L. Gignac
- et al.
- 2006
- Scanning
Three-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomography
- Peter Ercius
- David A. Muller
- et al.
- 2006
- AMC 2006
Physical, electrical, and reliability characterization of Ru for Cu interconnects
- C.-C. Yang
- T. Spooner
- et al.
- 2006
- IITC 2006
Tunable Workfunction for Fully Silicied Gates (FUSI) and Proposed Mechanisms
- Y.-H. Kim
- C. Cabral Jr.
- et al.
- 2006
- VLSI-TSA 2006