Kigook Song, Robert D. Miller, et al.
Macromolecules
Electromigration in 0.07 μm wide Cu interconnections has been investigated for sample temperatures from 213 to 300°C. The effect of atomic-layer- or physical-vapor-deposited TaNx and physical-vapor-deposited Ta liner layers in Cu damascene lines on electromigration was also studied. A lower lifetime and activation energy for electromigration was observed in tested lines with sidewall voids. Similar electromigration lifetime and activation energy observed from samples with either atomic-layer- or physical-vapor- deposited TaNx suggested that the dominant diffusion paths in the Cu lines were not sensitive to the TaNx layer and were along the Cu/dielectric interface and/or grain boundaries. © 2007 The Electrochemical Society.
Kigook Song, Robert D. Miller, et al.
Macromolecules
Kenneth R. Carter, Robert D. Miller, et al.
Macromolecules
Heinz Schmid, Hans Biebuyck, et al.
Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures