LCDU improvement of EUV-patterned vias with DSA
- Jing Guo
- Dustin W. Janes
- et al.
- 2019
- MEMS/NEMS/MOEMS 2019
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38 results for Charlie Liu
The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
- Chi-Chun Liu
- Yann Mignot
- et al.
- 2018
- SPIE Advanced Lithography 2018
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
Advanced fast 3D DSA model development and calibration for design technology co-optimization
- Kafai Lai
- Balint Meliorisz
- et al.
- 2017
- SPIE Advanced Lithography 2017
Directed self-assembly patterning strategies for phase change memory applications
- Robert L. Bruce
- Gloria Fraczak
- et al.
- 2017
- SPIE Advanced Lithography 2017
An OCD perspective of line edge and line width roughness metrology
- Ravi Bonam
- R. Muthinti
- et al.
- 2017
- SPIE Advanced Lithography 2017
Comprehensive analysis of line-edge and line-width roughness for EUV lithography
- Ravi Bonam
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
Strategies to enable directed self-Assembly contact hole shrink for tight pitches
- Kristin Schmidt
- Hitoshi Osaki
- et al.
- 2016
- SPIE Advanced Lithography 2016