Lower resistance scaled metal contacts to silicide for advanced CMOS
- A. Topol
- C. Sheraw
- et al.
- 2006
- VLSI Technology 2006
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22 results for You Li
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006
Dual stress liner enhancement in hybrid orientation technology
- C. Sheraw
- M. Yang
- et al.
- 2005
- VLSI Technology 2005
Ultra-thin SOI replacement gate CMOS with ALD TaN / high-k gate stack
- B. Doris
- B.P. Linder
- et al.
- 2005
- VLSI-TSA 2005
Dual stress liner for high performance sub-45nm gate length SOI CMOS manufacturing
- H.S. Yang
- R. Malik
- et al.
- 2004
- IEDM 2004
Body voltage and history effect sensitivity to key device parameters in 90nm PD-SOI
- S. Kawanaka
- M.B. Ketchen
- et al.
- 2004
- IEEE International SOI Conference 2004
Dual work function metal gate CMOS using CVD metal electrodes
- V. Narayanan
- A.C. Callegari
- et al.
- 2004
- VLSI Technology 2004
Vertically self-aligned buried junction formation for ultrahigh-density DRAM applications
- J. Beintner
- Y. Li
- et al.
- 2004
- IEEE Electron Device Letters
Device Design Considerations for Ultra-Thin SOI MOSFETs
- B. Doris
- M. Ieong
- et al.
- 2003
- IEDM 2003
On the retention time distribution of dual-channel vertical DRAM technologies
- J. Beintner
- Y. Li
- et al.
- 2003
- VLSI-TSA 2003