Realization of ultra-low power I/O
- Lei Shan
- Timothy Dickson
- et al.
- 2013
- ECTC 2013
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11 results for Dale Becker
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
Direct integration of dense parallel optical interconnects on a first level package for high-end servers
- Evan G. Colgan
- Bruce Furman
- et al.
- 2005
- ECTC 2005
A Methodology to Optimize the Number and Placement of Decoupling Capacitors in a Multilevel Power Delivery Network
- Ram Krishna
- Thong Nguyen
- et al.
- 2022
- EDAPS 2022
An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- ECOC 2022
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- Networks 2022
Vref optimization in DDR4 RDIMMs for improved timing margins
- Saravanan Sethuraman
- Anil Lingambudi
- et al.
- 2014
- EDAPS 2014
Signal propagation over perforated reference planes
- Lei Shan
- Mark Ritter
- et al.
- 2007
- IEEE-SPI 2007
The use of fast integral equations solvers for practical package and interconnect analysis
- J.D. Morsey
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2006
- OFC 2006