Ronald Troutman
Synthetic Metals
Conference paper
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
Abstract
We report on progress and results towards the development of a high speed, low cost, low energy (<4pJ/bit) chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.
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