3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008
Publications
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59 results for Bing Dang
Reliability testing of through-silicon vias for high-current 3D applications
- Steven L. Wright
- Paul S. Andry
- et al.
- 2008
- ECTC 2008
3D stacking of chips with electrical and microfluidic I/O interconnects
- Calvin R. King Jr.
- Deepak Sekar
- et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
'Trimodal' wafer-level package: Fully compatible electrical, optical, and fluidic chip I/O interconnects
- Muhannad S. Bakir
- Bing Dang
- et al.
- 2007
- ECTC 2007
3D chip stacking technology with low-volume lead-free interconnections
- K. Sakuma
- P. Andry
- et al.
- 2007
- ECTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
A Versatile Data Fabric for Advanced IoT-Based Remote Health Monitoring
- Italo Buleje
- Vince Siu
- et al.
- 2023
- ICDH 2023
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- Bing Dang
- Michael Shapiro
- et al.
- 2010
- IEEE Electron Device Letters