Electromigration resistant power delivery systems
- Deepak C. Sekar
- Bing Dang
- et al.
- 2007
- IEEE Electron Device Letters
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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59 results for Bing Dang
Development of a Smart Sleep Mask with Multiple Sensors
- Bing Dang
- John Dicarlo
- et al.
- 2021
- EMBC 2021
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Boiling sensitivity analysis of asymmetrically heated micro-scale devices
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2016
- ITherm 2016
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Circuits 2015
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
- Kevin Tien
- Noah Sturcken
- et al.
- 2015
- VLSI Technology 2015
Local measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Measurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
High-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011