Characterization of TSV-induced loss and substrate noise coupling in advanced three-dimensional CMOS SOI technology
- Xiaoxiong Gu
- Joel A. Silberman
- et al.
- 2013
- IEEE Transactions on CPMT
Publications
Date
Featured collections
Popular topics
59 results for Bing Dang
An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2012
- IEEE Journal of Solid-State Circuits
Integrated microfluidic cooling and interconnects for 2D and 3D chips
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- Katsuyuki Sakuma
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2008
- IBM J. Res. Dev
3D chip stacking with C4 technology
- Bing Dang
- Steven L. Wright
- et al.
- 2008
- IBM J. Res. Dev
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
- Paul S. Andry
- Cornelia K. Tsang
- et al.
- 2008
- IBM J. Res. Dev
Sea-of-Leads MEMS I/O interconnects for low-k IC packaging
- Bing Dang
- Muhannad S. Bakir
- et al.
- 2006
- JMEMS
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev