Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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54 results for Katsuyuki Sakuma

Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- - B. Dang
  - S.L. Wright
  - et al.
- 2007
- ECTC 2007
Role of Interfacial Microstructure on Electromigration Behavior of The Hybrid Bonding in 3D Integration
- - Sari Zerey
  - Roy Yu
  - et al.
- 2024
- MRS Spring Meeting 2024
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- - Sathya Raghavan
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023
Wearable Nail Deformation Sensing for Behavioral and Biomechanical Monitoring and Human-Computer Interaction
- - Katsuyuki Sakuma
  - Avner Abrami
  - et al.
- 2018
- Scientific Reports
Turning the Finger into a Writing Tool
- - Katsuyuki Sakuma
  - Gaddi Blumrosen
  - et al.
- 2019
- EMBC 2019
Flexible Piezoresistive Sensors Fabricated by Spalling Technique
- - Katsuyuki Sakuma
  - Huan Hu
  - et al.
- 2018
- IFETC 2018
3D integration ESD protection design and analysis
- - Souvick Mitra
  - Ephrem Gebreselasie
  - et al.
- 2015
- EOS/ESD 2015
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- - Keiji Matsumoto
  - Soichiro Ibaraki
  - et al.
- 2013
- 3DIC 2013
Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration
- - Akiko Okada
  - Masatsugu Nimura
  - et al.
- 2012
- LTB-3D 2012
Vacuum underfill technology for advanced packaging (IMPACT 2011)
- - M. Hoshiyama
  - M. Hasegawa
  - et al.
- 2011
- IMPACT 2011