Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
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56 results for Katsuyuki Sakuma
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
Role of Interfacial Microstructure on Electromigration Behavior of The Hybrid Bonding in 3D Integration
- Sari Zerey
- Roy Yu
- et al.
- 2024
- MRS Spring Meeting 2024
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- Sathya Raghavan
- Hiroyuki Mori
- et al.
- 2023
- ECTC 2023
Wearable Nail Deformation Sensing for Behavioral and Biomechanical Monitoring and Human-Computer Interaction
- Katsuyuki Sakuma
- Avner Abrami
- et al.
- 2018
- Scientific Reports
Turning the Finger into a Writing Tool
- Katsuyuki Sakuma
- Gaddi Blumrosen
- et al.
- 2019
- EMBC 2019
Flexible Piezoresistive Sensors Fabricated by Spalling Technique
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2018
- IFETC 2018
3D integration ESD protection design and analysis
- Souvick Mitra
- Ephrem Gebreselasie
- et al.
- 2015
- EOS/ESD 2015
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Soichiro Ibaraki
- et al.
- 2013
- 3DIC 2013
Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
- Akiko Okada
- Masatsugu Nimura
- et al.
- 2012
- LTB-3D 2012