Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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54 results for Katsuyuki Sakuma

Simplified 20-μm pitch vertical interconnection process for 3D chip stacking
- - Katsuyuki Sakuma
  - Noriyasu Nagai
  - et al.
- 2009
- IEEJ Transactions on Electrical and Electronic Engineering
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- - John U. Knickerbocker
  - Paul S. Andry
  - et al.
- 2008
- IBM J. Res. Dev
3D chip stacking with C4 technology
- - Bing Dang
  - Steven L. Wright
  - et al.
- 2008
- IBM J. Res. Dev