Controlled 3D nanoparticle deposition by drying of colloidal suspension in designed thin micro-porous architectures
- Feifei Qin
- Meng Su
- et al.
- 2020
- Int. J. Heat Mass Transf.
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152 results for Thomas Brunschwiler
Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
- Luca Del Carro
- Alfred A. Zinn
- et al.
- 2019
- Journal of Electronic Materials
Tricoupled hybrid lattice Boltzmann model for nonisothermal drying of colloidal suspensions in micropore structures
- Feifei Qin
- Ali Mazloomi Moqaddam
- et al.
- 2019
- Physical Review E
Study of non-isothermal liquid evaporation in synthetic micro-pore structures with hybrid lattice Boltzmann model
- Feifei Qin
- Luca Del Carro
- et al.
- 2019
- Journal of Fluid Mechanics
On the Evaporation of Colloidal Suspensions in Confined Pillar Arrays
- Jonas Zürcher
- Brian R. Burg
- et al.
- 2018
- Transport in Porous Media
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- Rahel Straessle
- Severin Zimmermann
- et al.
- 2018
- IEEE Transactions on CPMT
Relief printing of micron-sized electrical conductive structures on silicon
- S. Gerke
- Jonas Zürcher
- et al.
- 2017
- Flexible and Printed Electronics
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- Jonas Zürcher
- Xi Chen
- et al.
- 2016
- IEEE Transactions on CPMT
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging