Swagath Venkataramani, Vijayalakshmi Srinivasan, et al.
ISCA 2021
This article describes the design, fabrication, and thermal performance of 300-mm-diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18 °C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. The average apparent heat transfer coefficient, happ, was about 104000 W/(K-m2).
Swagath Venkataramani, Vijayalakshmi Srinivasan, et al.
ISCA 2021
Xuan Li, Nathan Youngblood, et al.
IEDM 2020
G.S. Syed, K. Brew, et al.
IEDM 2023
Pavlos Maniotis, Daniel M. Kuchta
J. of Opt. Comm. and Netw.