Boiling sensitivity analysis of asymmetrically heated micro-scale devices
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2016
- ITherm 2016
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67 results for Evan Colgan
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
Local measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2015
- InterPACK 2015
Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
Clog-free translocation of long DNA in nanofluidic pillar arrays and 30 nm wide channels: A fabrication and hydrodynamic study
- Chao Wang
- Robert L. Bruce
- et al.
- 2014
- MicroTAS 2014
Measurement of back end of line thermal resistance for 3D chip stacks
- E.G. Colgan
- R.J. Polastre
- et al.
- 2013
- SEMI-THERM 2013
Measurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
Facility level energy and cost analyses for water cooled supercomputer systems
- Evan G. Colgan
- Madhusudan K. Iyengar
- 2009
- IPACK 2009
Hotspot-adapted cold plates to maximize system efficiency
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2009
- THERMINIC 2009
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008