Measurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
Publications
68 results for Evan Colgan
Facility level energy and cost analyses for water cooled supercomputer systems
- Evan G. Colgan
- Madhusudan K. Iyengar
- 2009
- IPACK 2009
Hotspot-adapted cold plates to maximize system efficiency
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2009
- THERMINIC 2009
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008
BEOL thermal characterization for 3-D packaging
- J. Wakil
- E.G. Colgan
- et al.
- 2008
- IMAPS 2008
A practical implementation of silicon microchannel coolers for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
High performance and subambient silicon microchannel cooling
- E.G. Colgan
- B.K. Furman
- et al.
- 2006
- Journal of Heat Transfer
High performance and sub-ambient silicon microchannel cooling
- E.G. Colgan
- B.K. Furman
- et al.
- 2006
- ICNMM 2006
Development of an experimental facility for investigating single-phase liquid flow in microchannels
- Mark E. Steinke
- Satish G. Kandlikar
- et al.
- 2006
- Heat Transfer Engineering