Optimization of Ta-Si-N thin films for use as oxidation-resistant diffusion barriers
- C. Cabral
- K.L. Saenger
- et al.
- 2000
- Journal of Materials Research
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162 results for Cyril Cabral
Fabrication and performance limits of sub-0.1 μm Cu interconnects
- T.S. Kuan
- C.K. Inoki
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
Oxygen stoichiometry in PdOx and PdOxPt electrode layers during processing of ferroelectric and high-epsilon perovskites
- K.L. Saenger
- C. Cabral Jr.
- et al.
- 2000
- Journal of Materials Research
Mechanisms for enhanced formation of the C54 phase of titanium silicide ultra-large-scale integration contacts
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 2000
- Annual Review of Materials Science
Microstructural analysis of copper interconnections using picosecond ultrasonics
- James M.E. Harper
- Sandra G. Malhotra
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering
- K.L. Saenger
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Phase formation and resistivity in the ternary system Ti-Nb-Si
- Aliette Mouroux
- Marylène Roux
- et al.
- 1999
- Journal of Applied Physics
Characterization of plated Cu thin film microstructures
- L. Gignac
- K.P. Rodbell
- et al.
- 1999
- MRS Spring Meeting 1999
The future of silicide for CMOS contacts
- R.A. Roy
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999
Mechanisms for microstructure evolution in electroplated copper thin films
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- MRS Spring Meeting 1999