Benchmarking study of 3D mask modeling for 2 and 1x nodes
- Chang An Wang
- Chao-Chun Liang
- et al.
- 2013
- SPIE Advanced Lithography 2013
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26 results for Derren Dunn
C-Quad polarized illumination for back end thin wire: Moving beyond annular illumination regime
- Sohan Singh Mehta
- Hyung-Rae Lee
- et al.
- 2009
- SPIE Advanced Lithography 2009
32 NM Logic patterning options with immersion lithography
- K. Lai
- S. Burns
- et al.
- 2008
- SPIE Advanced Lithography 2008
Dark field Double Dipole Lithography (DDL) for back-end-of-line processes
- M. Burkhardt
- Sean Burns
- et al.
- 2007
- SPIE Advanced Lithography 2007
BEOL integration of highly damage -resistant porous ultra low-k material using direct CMP and via-first process
- T. Iijima
- Q. Lin
- et al.
- 2006
- IITC 2006
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- V. McGahay
- G. Bonilla
- et al.
- 2006
- IITC 2006
A SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- Matthew Angyal
- Jason Gill
- et al.
- 2005
- AMC 2005
Plasma induced dielectric modification: Etching challenges for 65nm and beyond technology nodes
- N. Fuller
- M.A. Worsley
- et al.
- 2005
- ISTC 2005
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
90 nm SiCOH technology in 300 mm manufacturing
- L. Clevenger
- M. Yoon
- et al.
- 2004
- ADMETA 2004