Spacer-defined double patterning for 20-nm and beyond logic BEOL technology
- Ryoung-Han Kim
- Chiew-Seng Koay
- et al.
- 2011
- SPIE Advanced Lithography 2011
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31 results for Sean Burns
Fundamental investigation of Negative Tone Development (NTD) for the 22nm node (and beyond)
- Guillaume Landie
- Yongan Xu
- et al.
- 2011
- SPIE Advanced Lithography 2011
Optimization of pitch-split double patterning photoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- SPIE Advanced Lithography 2011
Overcoming the challenges of 22-nm node patterning through litho-design co-optimization
- Martin Burkharde
- J.C. Arnold
- et al.
- 2009
- SPIE Advanced Lithography 2009
Graded spin-on organic bottom antireflective coating for high NA lithography
- Dario L. Goldfarb
- Sean D. Burns
- et al.
- 2008
- SPIE Advanced Lithography 2008
22 nm technology compatible fully functional 0.1 μm 2 6T-sram cell
- B. Haran
- A. Kumar
- et al.
- 2008
- IEDM 2008
Graded spin-on organic bottom antireflective coating for high na immersion lithography
- Dario L. Goldfarb
- Libor Vyklicky
- et al.
- 2008
- J. Photopolym. Sci. Tech.
32 NM Logic patterning options with immersion lithography
- K. Lai
- S. Burns
- et al.
- 2008
- SPIE Advanced Lithography 2008
Trilayer development for 193 nm immersion lithography
- Sean Burns
- Martin Burkhardt
- et al.
- 2007
- J. Photopolym. Sci. Tech.
Dark field Double Dipole Lithography (DDL) for back-end-of-line processes
- M. Burkhardt
- Sean Burns
- et al.
- 2007
- SPIE Advanced Lithography 2007