Pulsed EM field response of a thin, high-contrast, finely layered structure with dielectric and conductive properties
- Adrianus T. de Hoop
- Lijun Jiang
- 2009
- IEEE Trans Antennas Propag
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24 results for Li Jun Jiang
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
Electromagnetic simulation for inhomogeneous interconnect and packaging structures
- Lijun Jiang
- Barry J. Rubin
- et al.
- 2007
- IEEE Topical Meeting EPEPS 2007
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
- Jason Morsey
- Alina Deutsch
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
The use of fast integral equations solvers for practical package and interconnect analysis
- J.D. Morsey
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Integral equation solvers for real world applications -Some challenge problems
- W.C. Chew
- I.T. Chiang
- et al.
- 2006
- APS 2006
Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach
- L. Jiang
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
A domain decomposition scheme based on equivalence theorem
- Mao-Kun Li
- Weng C. Chew
- et al.
- 2006
- Microwave and Optical Technology Letters
A mixed-form fast multipole algorithm
- Li Jun Jiang
- Weng Cho Chew
- 2005
- IEEE Trans Antennas Propag