Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- B. Dang
- S.L. Wright
- et al.
- 2007
- ECTC 2007
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112 results for S.L. Wright
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
- S.L. Wright
- R.J. Polastre
- et al.
- 2006
- ECTC 2006
Pb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
A CMOS-compatible process for fabricating electrical through-vias in silicon
- P. Andry
- C. Tsang
- et al.
- 2006
- ECTC 2006
Lateral p-i-n photodetectors with 18 GHz bandwidth at 1.3 μ m wavelength and small bias voltages
- Sandip Tiwari
- Jeremy Burroughes
- et al.
- 1991
- IEDM 1991
Complementary p- and n-channel quantum-well MI3SFET's
- R.A. Kiehl
- M.A. Olson
- et al.
- 1988
- IEDM 1988
SELF-ALIGNED PROCESSES FOR THE GaAs GATE FET.
- H. Baratte
- D.C. La Tulipe
- et al.
- 1985
- IEDM 1985
Three-dimensional chip stack with integrated decoupling capacitors and thru-si via interconnects
- Bing Dang
- Michael Shapiro
- et al.
- 2010
- IEEE Electron Device Letters
Reduction of Backgating in GaAs SISFET’s with a Low-Temperature Buffer
- Paul M. Solomon
- Steven L. Wright
- et al.
- 1991
- IEEE Electron Device Letters