Electromigration in two-level bamboo grain structure Al(Cu)/W interconnections
- C.-K. Hu
- N.J. Mazzeo
- et al.
- 1993
- Materials Chemistry and Physics
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149 results for C. K. Hu
Electromigration in two-level interconnect structures with Al alloy lines and W studs
- C.-K. Hu
- P.S. Ho
- et al.
- 1992
- Journal of Applied Physics
Sub-μm linewidth input coils for low Tc integrated thin-film dc superconducting quantum interference devices
- M.B. Ketchen
- K. Stawiasz
- et al.
- 1992
- Applied Physics Letters
Reactive ion etching of Nb/A1Ox/Nb for Josephson technology
- C.-K. Hu
- N.J. Mazzeo
- et al.
- 1991
- Thin Solid Films
Sub-μm, planarized, Nb-AlOx-Nb Josephson process for 125 mm wafers developed in partnership with Si technology
- M.B. Ketchen
- D.J. Pearson
- et al.
- 1991
- Applied Physics Letters
Reaction between Cu and TiSi2 across different barrier layers
- Chin-An Chang
- Chao-Kun Hu
- 1990
- Applied Physics Letters
Dry etching of TiN/Al(Cu)/Si for very large scale integrated local interconnections
- K.W. Choi
- N.J. Mazzeo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
On the preparation of cross-sectional TEM samples using lithographic processing and reactive ion-etching
- J.T. Wetzel
- M. Jost
- et al.
- 1989
- Ultramicroscopy
A process for improved Al (Cu) reactive ion etching
- C.-K. Hu
- B. Canney
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films