Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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63 results for J. Demarest

Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- - Benjamin D. Briggs
  - C.B. Pcethala
  - et al.
- 2018
- IITC 2018
Experimental study of PVD Cu/CVD Co bilayer dissolution for BEOL Cu interconnect applications
- - X. Sun
  - B. Peethala
  - et al.
- 2017
- ECS Meeting 2017
Dual beam laser annealing for contact resistance reduction and its impact on VLSI integrated circuit variability
- - Zuoguang Liu
  - Oleg Gluschenkov
  - et al.
- 2017
- VLSI Technology 2017
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- - Takeshi Nogami
  - X. Zhang
  - et al.
- 2017
- VLSI Technology 2017
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- - Takeshi Nogami
  - Raghuveer Patlolla
  - et al.
- 2017
- IITC 2017
FINFET technology featuring high mobility SiGe channel for 10nm and beyond
- - Dechao Guo
  - G. Karve
  - et al.
- 2016
- VLSI Technology 2016
Advanced in-line metrology strategy for self-aligned quadruple patterning
- - Robin Chao
  - Mary Breton
  - et al.
- 2016
- SPIE Advanced Lithography 2016
Bottom oxidation through STI (BOTS) - A novel approach to fabricate dielectric isolated FinFETs on bulk substrates
- - K. Cheng
  - S.-C. Seo
  - et al.
- 2014
- VLSI Technology 2014
Copper-to-dielectric heterogeneous bonding for 3D integration
- - Wei Lin
  - Juntao Li
  - et al.
- 2014
- LTB-3D 2014
Perspectives into CVD-cobalt liner induced increase in resistivity of Cu interconnect
- - Wei Lin
  - Xunyuan Zhang
  - et al.
- 2013
- ADMETA 2013