Ru Liner Scaling with ALD TaN Barrier Process for Low Resistance 7 nm Cu Interconnects and beyond
- Koichi Motoyama
- O. Van Der Straten
- et al.
- 2018
- IITC 2018
Publications
55 results for T. Standaert
A Study on SADP Process Refresh for Patterning Correction
- James H.-C. Chen
- Isabel C Estrada-Raygoza
- et al.
- 2018
- IITC 2018
CMP development for Ru liner structures beyond 14nm
- Raghuveer Patlolla
- Koichi Motoyama
- et al.
- 2018
- ECS J. Solid State Sci. Technol.
Defect and grain boundary scattering in tungsten: A combined theoretical and experimental study
- Nicholas A. Lanzillo
- H. Dixit
- et al.
- 2018
- Journal of Applied Physics
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- Nicholas A. Lanzillo
- Oscar D. Restrepo
- et al.
- 2018
- Applied Physics Letters
Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
Line Resistance Reduction in Advanced Copper Interconnects
- Chih-Chao Yang
- T. Standaert
- et al.
- 2017
- IEEE Electron Device Letters
Comparison of key fine-line BEOL metallization schemes for beyond 7 nm node
- Takeshi Nogami
- X. Zhang
- et al.
- 2017
- VLSI Technology 2017
Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
- N. Loubet
- T.B. Hook
- et al.
- 2017
- VLSI Technology 2017
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- Takeshi Nogami
- Raghuveer Patlolla
- et al.
- 2017
- IITC 2017