Publications

55 results for T. Standaert

Evaluation of Cu CMP barrier slurries for Ultra Low-k dielectric film (k~2.4) for 45nm technology
- - Feng Zhao
  - Laertis Economikos
  - et al.
- 2007
- ICPT 2007
Characterization, Modeling and Extraction of Cu Wire Resistance for 65 nm Technology
- - Ning Lu
  - M. Angyal
  - et al.
- 2007
- CICC 2007
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- - S. Narasimha
  - K. Onishi
  - et al.
- 2006
- IEDM 2006
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- - S. Sankaran
  - S. Arai
  - et al.
- 2006
- IEDM 2006
Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching
- - Y. Hsu
  - T. Standaert
  - et al.
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures