Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- Alina Deutsch
- Roger S. Krabbenhoft
- et al.
- 2010
- IEEE Trans Electromagn Compat
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52 results for T. Standaert
Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching
- Y. Hsu
- T. Standaert
- et al.
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures