Interconnects in the third dimension: Design challenges for 3D ICs
- Kerry Bernstein
- Paul Andry
- et al.
- 2007
- DAC 2007
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22 results for John Magerlein
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ECTC 2005
Coupling a basin modeling and a seismic code using MOAB
- Mi Yan
- Kirk Jordan
- et al.
- 2012
- ICCS 2012
Measurement of microbump thermal resistance in 3D chip stacks
- E.G. Colgan
- Paul Andry
- et al.
- 2012
- SEMI-THERM 2012
Accelerating Computational Fluid Dynamics applications on the IBM Blue Gene/P supercomputer
- Pascal Vezolle
- Jerry Heyman
- et al.
- 2010
- SBAC-PAD 2010
High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques
- N. Hoivik
- D. Liu
- et al.
- 2007
- APS 2007
High performance and sub-ambient silicon microchannel cooling
- E.G. Colgan
- B.K. Furman
- et al.
- 2006
- ICNMM 2006
Silicon carrier with deep through-vias, fine pitch wiring, and through cavity for parallel optical transceiver
- Chirag S. Patel
- Cornelia K. Tsang
- et al.
- 2005
- ADMETA 2005
A practical implementation of silicon microchannel coolers for high power chips
- E.G. Colgan
- B.K. Furman
- et al.
- 2005
- SEMI-THERM 2005