Spatial mapping of non-uniform time-to-breakdown and physical evidence of defect clustering
- Ernest Y. Wu
- Baozhen Li
- et al.
- 2014
- VLSI Technology 2014
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Time-dependent clustering model versus combination-based approach for BEOL/MOL and FEOL non-uniform dielectric breakdown: Similarities and disparities
- Ernest Y. Wu
- Baozhen Li
- et al.
- 2014
- IRPS 2014
Atomic flux divergence based current conversion scheme for signal line electromigration reliability assessment
- Zhong Guan
- Malgorzata Marek-Sadowska
- et al.
- 2014
- IITC/AMC 2014
Thermal stress control in Cu interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IITC/AMC 2014
Microstructure modulation in copper interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IEEE Electron Device Letters
Electromigration challenges for advanced on-chip Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2014
- Microelectronics Reliability
A time-dependent clustering model for non-uniform dielectric breakdown
- Ernest Y. Wu
- B. Li
- et al.
- 2013
- IEDM 2013
Modeling of time-dependent non-uniform dielectric breakdown using a clustering statistical approach
- Ernest Y. Wu
- Baozhen Li
- et al.
- 2013
- Applied Physics Letters
Cu reflows on Ru
- C.-C. Yang
- Baozhen Li
- et al.
- 2013
- ECS Solid State Letters
Optimization of Cu damascene electrodeposition process in ULSI for yield and reliability improvement
- Ingrid Shao
- T. Cheng
- et al.
- 2013
- ECS Transactions