Min-log approach to modeling dielectric breakdown data
- Emmanuel Yashchin
- Baozhen Li
- et al.
- 2012
- IRPS 2012
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60 results for Baozhen Li
In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects
- Chih-Chao Yang
- Fen Chen
- et al.
- 2012
- IITC 2012
Effects of metal capping on thermal annealing of copper interconnects
- Chih-Chao Yang
- B. Li
- et al.
- 2012
- IEEE Electron Device Letters
In situ Co/SiC(N,H) capping layers for Cu/Low-k interconnects
- Chih-Chao Yang
- B. Li
- et al.
- 2012
- IEEE Electron Device Letters
Co capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2012
- Microelectronic Engineering
Reflow of copper on ruthenium
- C.-C. Yang
- Y. Loquet
- et al.
- 2011
- ADMETA 2011
Invasion percolation model for abnormal TDDB characteristic of ULK dielectrics with Cu interconnect at advanced technology nodes
- F. Chen
- Michael Shinosky
- et al.
- 2011
- IRPS 2011
Post-breakdown statistics and acceleration characteristics in high-K dielectric stacks
- Ernest Wu
- Jordi Sune
- et al.
- 2011
- IRPS 2011
Low-temperature reflow anneals of Cu on Ru
- C.-C. Yang
- Fenton R. McFeely
- et al.
- 2011
- IEEE Electron Device Letters
Evaluation of direct cu electroplating on Ru: Feature fill, parametric, and reliability
- C.-C. Yang
- B. Li
- et al.
- 2011
- IEEE Electron Device Letters