Through silicon via aware design planning for thermally efficient 3-D integrated circuits
- Yibo Chen
- Eren Kursun
- et al.
- 2013
- IEEE TCADIS
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19 results for Eren Kursun
Spatial and temporal thermal characterization of stacked multicore architectures
- Eren Kursun
- Jamil Wakil
- et al.
- 2012
- ACM JETC
Fast poisson solvers for thermal analysis
- Haifeng Qian
- Sachin S. Sapatnekar
- et al.
- 2012
- ACM TODAES
Characterizing power and temperature behavior of POWER6-based system
- Víctor Jiménez
- Francisco J. Cazorla
- et al.
- 2011
- IEEE JESTCS
Energy-aware accounting and billing in large-scale computing facilities
- Víctor Jiménez
- Francisco J. Cazorla
- et al.
- 2011
- IEEE Micro
Exploring the effects of on-chip thermal variation on high-performance multicore architectures
- Chen-Yong Cher
- Eren Kursun
- 2011
- Transactions on Architecture and Code Optimization
Opportunities and challenges for 3D systems and their design
- Philip Emma
- Eren Kursun
- 2009
- IEEE Design and Test of Computers
Temperature variation characterization and thermal management of multicore architectures
- Eren Kursun
- Chen-Yong Cher
- 2009
- IEEE Micro
Is 3D chip technology the next growth engine for performance improvement?
- Philip G. Emma
- Eren Kursun
- 2008
- IBM J. Res. Dev