High performance packaging laminates enable buses for exascale systems
- Lei Shan
- Young Kwark
- et al.
- 2015
- DesignCon 2015
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178 results for Christian Baks
A 1.4-pJ/b, power-scalable 16×12-Gb/s source-synchronous I/O with DFE receiver in 32nm SOI CMOS technology
- Timothy O. Dickson
- Yong Liu
- et al.
- 2014
- CICC 2014
A dual polarized stacked patch antenna for 94 GHz RFIC package applications
- Duixian Liu
- Md. Rashidul Islam
- et al.
- 2014
- APS 2014
Proximity effects between striplines and vias
- Young H. Kwark
- Renato Rimolo-Donadio
- et al.
- 2014
- EMC 2014
Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2014
- ECTC 2014
Preparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
A compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2014
- ECTC 2014
Latch-to-latch CMOS-driven optical link at 28 Gb/s
- Benjamin G. Lee
- Seongwon Kim
- et al.
- 2014
- CLEO 2014
30Gbps optical link utilizing heterogeneously integrated III-V/Si photonics and CMOS circuits
- Nicolas Dupuis
- Benjamin G. Lee
- et al.
- 2014
- OFC 2014
64Gb/s transmission over 57m MMF using an NRZ modulated 850nm VCSEL
- Daniel M. Kuchta
- Alexander V. Rylyakov
- et al.
- 2014
- OFC 2014