Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications
- K.N. Chen
- Cornelia Tsang
- et al.
- 2011
- Journal of Nanoscience and Nanotechnology
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22 results for K.N. Chen
Electrical performances and structural designs of copper bonding in wafer-level three-dimensional integration
- K.N. Chen
- A. Young
- et al.
- 2011
- Journal of Nanoscience and Nanotechnology
Wafer-level self-aligned nano tubular structures and templates for device applications
- K.N. Chen
- J.C. Arnold
- 2010
- Journal of Nanoscience and Nanotechnology
Investigation and effects of wafer bow in 3D integration bonding schemes
- K.N. Chen
- Y. Zhu
- et al.
- 2010
- Journal of Electronic Materials
The fabrication of a programmable via using phase-change material in CMOS-compatible technology
- Kuan-Neng Chen
- Lia Krusin-Elbaum
- 2010
- Nanotechnology
Thermal stress effects of Ge2Sb2Te5 phase change material: Irreversible modification with Ti adhesion layers and segregation of Te
- K.N. Chen
- C. Cabral Jr.
- et al.
- 2008
- Microelectronic Engineering
Wafer-level 3D integration technology
- Steven J. Koester
- Albert M. Young
- et al.
- 2008
- IBM J. Res. Dev
Evidence for segregation of Te in Ge2 Sb2 Te5 films: Effect on the "phase-change" stress
- L. Krusin-Elbaum
- C. Cabral
- et al.
- 2007
- Applied Physics Letters
Irreversible modification of Ge2Sb2Te5 phase change material by nanometer-thin Ti adhesion layers in a device-compatible stack
- C. Cabral Jr.
- K.N. Chen
- et al.
- 2007
- Applied Physics Letters
Bonding parameters of blanket copper wafer bonding
- K.N. Chen
- A. Fan
- et al.
- 2006
- Journal of Electronic Materials