Determination of transmission line parameters in time- and frequency domain for product related packaging structures
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2007
- IEEE-SPI 2007
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92 results for Alina Deutsch
Effect of noise on timing or data-pattern dependent delay variation when transmission-line effects are taken into account for on-chip wiring
- A. Deutsch
- H. Smith
- et al.
- 2007
- IEEE-SPI 2007
Parallelization of the reduced-coupling technique for a method-of-moments-based field solver used for product-level wide data-bus analysis
- A.J. Hesford
- J.D. Morsey
- et al.
- 2007
- IEEE Topical Meeting EPEPS 2007
Prediction of losses caused by roughness of metallization in printed-circuit boards
- Alina Deutsch
- Christopher W. Surovic
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
- Jason Morsey
- Alina Deutsch
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Distortion minimization for packaging level interconnects
- Haikun Zhu
- Rui Shi
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Practical considerations in the modeling and characterization of printed-circuit board wiring
- A. Deutsch
- R.S. Krabbenhoft
- et al.
- 2006
- IEEE-SPI 2006
Attenuation measurement technique for printed circuit board traces in a production environment
- Christian Schuster
- Alina Deutsch
- et al.
- 2006
- IEEE-SPI 2006
New methodology for combined simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- Alina Deutsch
- Howard H. Smith
- et al.
- 2006
- IEEE Transactions on Advanced Packaging
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005