Superior electrical properties of High Performance Glass Ceramic packaging for demanding SiGe, ASIC, microprocessor and advanced server applications
- Warren D. Dyckman
- Benjamin Fasano
- et al.
- 2005
- DPC 2005
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92 results for Alina Deutsch
The effect of power islands on delta-I noise, interconnect noise, and timing for wide, on-chip data-buses
- A. Deutsch
- H. Smith
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Losses caused by roughness of metallization in printed-circuit boards
- A. Deutsch
- C. Surovic
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
Extraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
- Alina Deutsch
- Thomas-Michael Winkel
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
A CAD methodology and tool for the characterization of wide on-chip buses
- I.M. Elfadel
- Alina Deutsch
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
Methodology to simulate delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- A. Deutsch
- H. Smith
- et al.
- 2004
- IEEE Topical Meeting EPEPS 2004
A CAD methodology and tool for the characterization of wide on-chip buses
- I.M. Elfadel
- A. Deutsch
- et al.
- 2004
- DATE 2004