Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2006
- OFC 2006
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23 results for George A. Katopis
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC/NFOEC 2005
Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz
- Thomas-Michael Winkel
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Direct integration of dense parallel optical interconnects on a first level package for high-end servers
- Evan G. Colgan
- Bruce Furman
- et al.
- 2005
- ECTC 2005
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
Novel packaging of parallel-optical interconnects for high-end servers
- Steven A. Rosenau
- Jonathan Simon
- et al.
- 2005
- OFC 2005
Extraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
- Alina Deutsch
- Thomas-Michael Winkel
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
Extraction of ε(f) and tan δ(f) for BT Insulator up to 30 GHz Using the Short-Pulse Propagation Technique
- A. Deutsch
- T.-M. Winkel
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003
Frequency-dependent crosstalk modeling for on-chip interconnections
- A. Deutsch
- H. Smith
- et al.
- 1998
- IEEE Topical Meeting EPEPS 1998
When are transmission-line effects important for on-chip interconnections?
- Alina Deutsch
- Gerard V. Kopcsay
- et al.
- 1997
- IEEE T-MTT