The role of texture in the electromigration behavior of pure aluminum lines
- D.B. Knorr
- K.P. Rodbell
- 1996
- Journal of Applied Physics
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126 results for Ken Rodbell
Effect of a surface layer on the stress relaxation of thin films
- M.D. Thouless
- K.P. Rodbell
- et al.
- 1996
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Cu segregation at the Al(Cu)/Al2O3 interface
- M. Copel
- K.P. Rodbell
- et al.
- 1995
- Applied Physics Letters
Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly
Correlation between special grain boundaries and electromigration behavior of aluminum thin films
- K.T. Lee
- J.A. Szpunar
- et al.
- 1995
- Canadian Metallurgical Quarterly
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
- C.-K. Hu
- K.P. Rodbell
- et al.
- 1995
- IBM J. Res. Dev
1/f noise and electromigration in aluminum films: The role of film microstructure and texture
- R.G. Smith
- G. Biery
- et al.
- 1994
- Applied Physics Letters
Texture in multilayer metallization structures
- D.P. Tracy
- D.B. Knorr
- et al.
- 1994
- Journal of Applied Physics
The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines
- E.G. Colgan
- K.P. Rodbell
- 1994
- Journal of Applied Physics
Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines
- E.G. Colgan
- K.P. Rodbell
- et al.
- 1994
- Journal of Applied Physics