Texture in multilayer metallization structures
- D.P. Tracy
- D.B. Knorr
- et al.
- 1994
- Journal of Applied Physics
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126 results for Ken Rodbell
The role of Cu distribution and Al2Cu precipitation on the electromigration reliability of submicrometer Al(Cu) lines
- E.G. Colgan
- K.P. Rodbell
- 1994
- Journal of Applied Physics
Kinetics of Al grain growth, Al2Cu precipitation, and dissolution in blanket thin films and fine lines
- E.G. Colgan
- K.P. Rodbell
- et al.
- 1994
- Journal of Applied Physics
1/f noise and electromigration in aluminum films: The role of film microstructure and texture
- R.G. Smith
- G. Biery
- et al.
- 1994
- Applied Physics Letters
Early stages of void formation in Al-Cu lines studied using positron annihilation
- P.J. Simpson
- M.T. Umlor
- et al.
- 1994
- Applied Physics Letters
Thermal behavior of Al and Al-3 at. % Ge thin films on Si wafers
- B.S. Lim
- W.C. Pritchet
- et al.
- 1993
- Journal of Applied Physics
Electromigration failure due to interfacial diffusion in fine Al alloy lines
- C.-K. Hu
- M.B. Small
- et al.
- 1993
- Applied Physics Letters
The microstructure, mechanical stress, texture, and electromigration behavior of Al-Pd alloys
- K.P. Rodbell
- D.B. Knorr
- et al.
- 1993
- Journal of Electronic Materials
Stress and phase changes in a low-thermal-expansion Al-3at.%Ge alloy film on oxidized silicon wafers
- K.N. Tu
- K.P. Rodbell
- et al.
- 1993
- Materials Chemistry and Physics
Use of the SUNY microbeam to investigate effects of mechanical treatment on metal/metal interdiffusion kinetics
- P.J. Ding
- W.A. Lanford
- et al.
- 1992
- Nuclear Inst. and Methods in Physics Research, B