Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
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126 results for Ken Rodbell
Texture evolution in Al(Cu) interconnect materials
- C.E. Murray
- K.P. Rodbell
- 2001
- MRS Proceedings 2001
Texture inheritance in Al(Cu) interconnect materials
- C.E. Murray
- K.P. Rodbell
- 2001
- Journal of Applied Physics
Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu
- G.A. Lucadamo
- Katayun Barmak
- et al.
- 2001
- Journal of Materials Research
Opportunities and challenges in ultra low k dielectrics for interconnect applications
- S. Purushothaman
- S.V. Nitta
- et al.
- 2001
- Technical Digest-International Electron Devices Meeting
The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines
- K.P. Rodbell
- L. Gignac
- et al.
- 2000
- Journal of Applied Physics
Probing capped and uncapped mesoporous low-dielectric constant films using positron annihilation lifetime spectroscopy
- Mihail P. Petkov
- Marc H. Weber
- et al.
- 2000
- Applied Physics Letters
Copper metallization for high performance silicon technology
- R. Rosenberg
- D. Edelstein
- et al.
- 2000
- Annual Review of Materials Science
Open volume defects (measured by positron annihilation spectroscopy) in thin film hydrogen-silsesquioxane spin-on-glass; correlation with dielectric constant
- Mihail P. Petkov
- Marc H. Weber
- et al.
- 1999
- Journal of Applied Physics
Doppler broadening positron annihilation spectroscopy: A technique for measuring open-volume defects in silsesquioxane spin-on glass films
- Mihail P. Petkov
- Marc H. Weer
- et al.
- 1999
- Applied Physics Letters