Conference paper
Modeling polarization for Hyper-NA lithography tools and masks
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
The increasing levels of device integration and the drive towards system-on-a-chip approaches have created an insatiable demand for fine pitch and high performance silicon back end of the line (BEOL) interconnects. This paper discusses the challenges associated with producing, characterizing and integrating porous dielectrics into the BEOL interconnects and presents results from integration evaluations.
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics