M. Hargrove, S.W. Crowder, et al.
IEDM 1998
The increasing levels of device integration and the drive towards system-on-a-chip approaches have created an insatiable demand for fine pitch and high performance silicon back end of the line (BEOL) interconnects. This paper discusses the challenges associated with producing, characterizing and integrating porous dielectrics into the BEOL interconnects and presents results from integration evaluations.
M. Hargrove, S.W. Crowder, et al.
IEDM 1998
Shaoning Yao, Wei-Tsu Tseng, et al.
ADMETA 2011
Frank Stem
C R C Critical Reviews in Solid State Sciences
A. Gupta, R. Gross, et al.
SPIE Advances in Semiconductors and Superconductors 1990