Shaoning Yao, Wei-Tsu Tseng, et al.
ADMETA 2011
The increasing levels of device integration and the drive towards system-on-a-chip approaches have created an insatiable demand for fine pitch and high performance silicon back end of the line (BEOL) interconnects. This paper discusses the challenges associated with producing, characterizing and integrating porous dielectrics into the BEOL interconnects and presents results from integration evaluations.
Shaoning Yao, Wei-Tsu Tseng, et al.
ADMETA 2011
Hiroshi Ito, Reinhold Schwalm
JES
J.V. Harzer, B. Hillebrands, et al.
Journal of Magnetism and Magnetic Materials
Imran Nasim, Melanie Weber
SCML 2024