Publications

13 results for Peter A. Gruber

Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping
- - Jae-Woong Nah
  - Peter A. Gruber
  - et al.
- 2010
- IMAPS 2010
Injection molded solder - a new fine pitch substrate bumping method
- - Jae-Woong Nah
  - Peter A. Gruber
  - et al.
- 2009
- ECTC 2009
An overview of Pb-free, flip-chip wafer-bumping technologies
- - Sung K. Kang
  - Peter Gruber
  - et al.
- 2008
- JOM
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- - D.Y. Shih
  - B. Dang
  - et al.
- 2008
- ICEPT-HDP 2008
C4NP Cu-cored Pb-free flip chip interconnections
- - Jae-Woong Nah
  - Stephen L. Buchwalter
  - et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- - Bing Dang
  - Da-Yuan Shih
  - et al.
- 2008
- ECTC 2008
C4NP - IBM manufacturing & reliability data for lead free flip chip solder bumping
- - Klaus Ruhmer
  - Eric Laine
  - et al.
- 2006
- IMPACT 2006
C4NP - First manufacturing & reliability data for high-end FlipChip solder bumping based on IBM's C4NP process
- - Klaus Ruhmer
  - Eric Laine
  - et al.
- 2006
- GBC 2006
Low-cost wafer bumping
- - Peter A. Gruber
  - Luc Bélanger
  - et al.
- 2005
- IBM J. Res. Dev
Injection molded solder technology for Pb-free wafer bumping
- - P. Gruber
  - D.Y. Shih
  - et al.
- 2004
- ECTC 2004