Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring
- A. Deutsch
- Roger Krabbenhoft
- et al.
- 2008
- SPI 2008
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
64 results for Barry J. Rubin
Electromagnetic simulation for inhomogeneous interconnect and packaging structures
- Lijun Jiang
- Barry J. Rubin
- et al.
- 2007
- IEEE Topical Meeting EPEPS 2007
The use of fast integral equations solvers for practical package and interconnect analysis
- J.D. Morsey
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Novel capacitance extraction method using direct boundary integral equation method and hierarchical approach
- L. Jiang
- Barry J. Rubin
- et al.
- 2006
- IEEE Topical Meeting EPEPS 2006
Principles for physical-based gridding of package structures
- Barry J. Rubin
- 2006
- IEEE Topical Meeting EPEPS 2006
The use of accelerated full-wave modeling to analyze power island coupling in a HyperBGA SCM
- J.D. Morsey
- A. Deutsch
- et al.
- 2005
- IEEE Topical Meeting EPEPS 2005
Understanding how to model difficult features and related physical effects in electrical packages
- Barry J. Rubin
- 2005
- IEEE Topical Meeting EPEPS 2005
A CAD methodology and tool for the characterization of wide on-chip buses
- I.M. Elfadel
- A. Deutsch
- et al.
- 2004
- DATE 2004
Methodology to simulate delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- A. Deutsch
- H. Smith
- et al.
- 2004
- IEEE Topical Meeting EPEPS 2004
Extraction of ε(f) and tan δ(f) for BT Insulator up to 30 GHz Using the Short-Pulse Propagation Technique
- A. Deutsch
- T.-M. Winkel
- et al.
- 2003
- IEEE Topical Meeting EPEPS 2003