A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.