A thermal simulation process based on electrical modeling for complex interconnect, packaging, and 3DI structures
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- IEEE Transactions on Advanced Packaging
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64 results for Barry J. Rubin
On the dual basis for solving electromagnetic surface integral equations
- Mei Song Tong
- Weng Cho Chew
- et al.
- 2009
- IEEE Trans Antennas Propag
The use of accelerated full-wave modeling to analyze power island coupling in a hyperBGA SCM
- Jason Morsey
- Alina Deutsch
- et al.
- 2007
- IEEE Transactions on Advanced Packaging
Electrical considerations for interconnections inside a computer
- G. Arjavalingam
- Barry J. Rubin
- 2006
- Fiber and Integrated Optics
New methodology for combined simulation of delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks
- Alina Deutsch
- Howard H. Smith
- et al.
- 2006
- IEEE Transactions on Advanced Packaging
IBM Intelligent Bricks project - Petabytes and beyond
- Winfried W. Wilcke
- Robert B. Garner
- et al.
- 2006
- IBM J. Res. Dev
Extraction of εr(f) and tan δ(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
- Alina Deutsch
- Thomas-Michael Winkel
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
A CAD methodology and tool for the characterization of wide on-chip buses
- I.M. Elfadel
- Alina Deutsch
- et al.
- 2005
- IEEE Transactions on Advanced Packaging
A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis
- I.M. Abe Elfadel
- Alina Deutsch
- et al.
- 2004
- IEEE Transactions on Advanced Packaging
A comprehensive 2-D inductance modeling approach for VLSI interconnects: Frequency-dependent extraction and compact circuit model synthesis
- Gerard V. Kopcsay
- Byron Krauter
- et al.
- 2002
- IEEE Transactions on VLSI Systems