Compliant Direct Attach Liquid Cooling
- Mark D. Schultz
- Pritish R. Parida
- 2024
- ITherm 2024
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32 results for Mark D. Schultz
An 800 Gb/s, 16 channel, VCSEL-based, co-packaged transceiver with fast laser sparing
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- ECOC 2022
MOTION: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers
- Daniel M. Kuchta
- Mounir Meghelli
- et al.
- 2022
- Networks 2022
Microprocessor Performance with Multiple Cooling Approaches
- Mark D. Schultz
- Pritish R. Parida
- et al.
- 2022
- ITherm 2022
High Performance Compliant Heat Sinks
- Mark D. Schultz
- 2022
- ITherm 2022
Summit and Sierra supercomputer cooling solutions
- Shurong Tian
- Todd Takken
- et al.
- 2020
- IBM J. Res. Dev
A single flexible coldplate cools multiple devices
- Shurong Tian
- Todd Takken
- et al.
- 2019
- ITherm 2019
Multi-Wavelength Optical Transceivers Integrated on Node (MOTION)
- Daniel M. Kuchta
- Jonathan E. Proesel
- et al.
- 2019
- OFC 2019
Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
Two-Phase Flow Characteristics in Radial Expanding Channels with Embedded Pin Fins
- Mark D. Schultz
- Michael Gaynes
- et al.
- 2018
- ITherm 2018